Method for making bipolar and CMOS integrated circuit structures

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 33, 437162, 437186, 437233, 437228, 156653, 156657, 357 34, 357 59, 148DIG10, 148DIG11, 148DIG117, 148DIG124, H01L 21365

Patent

active

048001716

ABSTRACT:
An improved method is described for constructing one or more integrated circuit components including bipolar and MOS devices on a silicon substrate without damaging areas of the substrate wherein active elements of the integrated circuit components will be formed. The method comprises forming multilayer pedestals of masking materials over the active regions of the substrate and subsequently removing these masking materials using wet etching to avoid damage to the substrate by dry etching.

REFERENCES:
patent: 4242791 (1981-01-01), Horng et al.
patent: 4318751 (1982-03-01), Horng
patent: 4381953 (1983-05-01), Ho et al.
patent: 4682409 (1987-07-01), Thomas et al.
patent: 4686763 (1987-08-01), Thomas et al.
patent: 4693782 (1975-09-01), Kikuchi et al.
Kooi et al., "Selective Oxidation . . . " Electrochem. Soc. Conf. Proc., 1973, pp. 860-879.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for making bipolar and CMOS integrated circuit structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making bipolar and CMOS integrated circuit structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making bipolar and CMOS integrated circuit structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-419667

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.