Process for forming in a silicon oxide layer a portion with vert

Fishing – trapping – and vermin destroying

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437 26, 437228, 156643, 156653, H01L 21425, H01L 21467

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active

048001708

ABSTRACT:
A process for forming a buried patterned silicon oxide layer in a silicon chip in which the layer is formed by implanting oxygen into the chip through a mask of silicon oxide on the surface of the silicon chip. The silicon oxide mask is formed to have essentially vertical side walls by interposing an irradiation step between a pair of isotropic wet etching steps in its formation.

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patent: 4456901 (1984-06-01), Kurtz et al.
patent: 4457820 (1984-07-01), Bergeron et al.
patent: 4508591 (1985-04-01), Bartlett et al.
Cellar, G. K. and Robinson, McD., "Seeded Recrystallization of Thick Polysilicon Films on Oxidized 3-in. Wafers," Applied Physics Letters, vol. 42, No. 1, Jan. 1983, pp. 99-101.
Jastrzebski, L., "Comparison of Different SOI Technologies", RCA Review, vol. 44, Jun. 1983, pp. 250-268.
Tuppen, G. C.; Taylor, M. R.; Hemment, P. L. F.; Arrowsmith, R. P., "Effect of Implantation Temperature on the Properties of Buried Oxide Layers in Silicon formed by Oxygen Ion Implantation," Applied Physics Letters, vol. 45, No. 1, Jul. 1984, pp. 57-59.

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