Method of making multi-layer circuit board

Details Method of making multi-layer circuit board Method of making multi-layer circuit board

2005-05-31

2010-12-14

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S852000, C427S096100

Reexamination Certificate

active

07849593

ABSTRACT:
The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.

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European Search Report issued in European Application No. EP 05 74 5977 dated Sep. 24, 2010.

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