Heat dissipating member, heat dissipating mechanism, and...

Details Heat dissipating member, heat dissipating mechanism, and... Heat dissipating member, heat dissipating mechanism, and...

2008-04-23

2010-02-09

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S718000, C257S719000, C361S688000, C361S704000, C361S715000, C361S719000

Reexamination Certificate

active

07660114

ABSTRACT:
A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.

REFERENCES:
patent: 4669028 (1987-05-01), Faa, Jr.
patent: 5526232 (1996-06-01), Kolberg et al.
patent: 6025991 (2000-02-01), Saito
patent: 6104611 (2000-08-01), Glover et al.
patent: 6421240 (2002-07-01), Patel
patent: 6496375 (2002-12-01), Patel et al.
patent: 6515858 (2003-02-01), Rodriguez et al.
patent: 6661664 (2003-12-01), Sarno et al.
patent: 6809932 (2004-10-01), Wu
patent: 7307844 (2007-12-01), Wu
patent: 2005/0117303 (2005-06-01), Nagahashi
patent: 2006/0219852 (2006-10-01), Kawai et al.
patent: 2006/0221573 (2006-10-01), Li
patent: 2006/0256515 (2006-11-01), Watanabe
patent: 2007/0139897 (2007-06-01), RaghuRam
patent: 2007/0167055 (2007-07-01), Watanabe
patent: 2007/0291450 (2007-12-01), Watanabe
patent: 2006-301816 (2006-11-01), None

Affiliated with

Also associated with

Rating

Heat dissipating member, heat dissipating mechanism, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating member, heat dissipating mechanism, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating member, heat dissipating mechanism, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4192813