Method of manufacturing electronic component integrated...

Details Method of manufacturing electronic component integrated... Method of manufacturing electronic component integrated...

2008-06-12

2010-11-09

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C029S852000, C257S698000, C438S622000, C438S623000

Reexamination Certificate

active

07827681

ABSTRACT:
There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

REFERENCES:
patent: 7235477 (2007-06-01), Ogawa
patent: 7473992 (2009-01-01), Ogawa
patent: 2006/0087020 (2006-04-01), Hirano et al.
patent: 2006/0125083 (2006-06-01), Ogawa
patent: 2007/0145568 (2007-06-01), Ogawa
patent: 2003-347722 (2003-12-01), None
patent: 2004/006331 (2004-01-01), None

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