Semiconductor device encapsulated by silicone resin...

Details Semiconductor device encapsulated by silicone resin... Semiconductor device encapsulated by silicone resin...

2007-07-17

2010-10-05

Sanders, Kriellion A (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257SE31117, C525S476000, C528S010000

Reexamination Certificate

active

07807736

ABSTRACT:
A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.

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patent: 2005/0129957 (2005-06-01), Kashiwagi et al.
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patent: 7-25987 (1995-01-01), None
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European Search Report dated Jan. 4, 2008 issued in corresponding European Application No. EP 07 01 3967.

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