Process for collective manufacturing of small volume high...

Details Process for collective manufacturing of small volume high... Process for collective manufacturing of small volume high...

2007-04-26

2010-11-23

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S737000, C438S752000, C438S753000

Reexamination Certificate

active

07838393

ABSTRACT:
The invention relates to a process for collective manufacturing of cavities and/or membranes (24), with a given thickness d, in a wafer said to be a semiconductor on insulator layer, comprising at least one semiconducting surface layer with a thickness d on an insulating layer, this insulating layer itself being supported on a substrate, this process comprising:etching of the semiconducting surface layer with thickness d, the insulating layer forming a stop layer, to form said cavities and/or membranes in the surface layer.

REFERENCES:
patent: 5374564 (1994-12-01), Bruel
patent: 6261066 (2001-07-01), Linnemann et al.
patent: 6395638 (2002-05-01), Linnemann et al.
patent: 2004/0012460 (2004-01-01), Cho et al.
patent: 2006/0094175 (2006-05-01), Cohen et al.
patent: 19719861 (1997-05-01), None
patent: 19719862 (1997-05-01), None
patent: 2681472 (1991-09-01), None
patent: 2371119 (2002-07-01), None
patent: 0190577 (2001-11-01), None
Hu, Min, “A Silicon-On-Insulator Based Micro Check Valve”, Journal of Micromechanics & Microengineering, vol. 4, No. 3, pp. 382-387 (Mar. 1, 2004).
Renard, Stephane et al., “Capacitive Pressure and Inertial Sensors by Epi-Soi Surface Micromachining”, Proceedings of IEEE Sensors 2002, Jun. 12-14, 2002 IEEE International Conference on Sensors, vol. 1 of 2, Conf. 1, pp. 1385-1388 (Jun. 12, 2002).
French Preliminary Search Report, FR 0651511, dated Dec. 26, 2006.
International Search Report, PCT/EP2007/054106, dated Aug. 2, 2007.

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