Bonding circuit for a line card and method for bonding data...

Details Bonding circuit for a line card and method for bonding data... Bonding circuit for a line card and method for bonding data...

2006-12-07

2010-10-05

Ngo, Ricky (Department: 2464)

Multiplex communications

Communication techniques for information carried in plural...

Assembly or disassembly of messages having address headers

C370S230000, C370S420000, C370S428000, C370S535000, C379S413020

Reexamination Certificate

active

07809019

ABSTRACT:
In a method for bonding data fragments, data fragments are delayed in such a manner that a first transmission time for a direct transmission of data fragments between a master line card and a terminal connection via a first group of subscriber lines of a telephone line bundle corresponds to a second transmission time for an indirect transmission of data fragments between the master line card, an uplink card, and a further line card via a second group of subscriber lines of the line bundle.

REFERENCES:
patent: 5953142 (1999-09-01), Chiaroni et al.
patent: 6831919 (2004-12-01), Choi
patent: 2002/0021468 (2002-02-01), Kato et al.
patent: 2002/0150100 (2002-10-01), White et al.
patent: 2004/0052268 (2004-03-01), Lewin et al.
patent: 2004/0141609 (2004-07-01), Shi
patent: 2006/0215689 (2006-09-01), Liu et al.
patent: WO 2004/066107 (2004-08-01), None

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