Substrate processing method, substrate processing system,...

Details Substrate processing method, substrate processing system,... Substrate processing method, substrate processing system,...

2008-07-30

2010-12-21

Toatley, Gregory J (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237100, C356S400000, C356S622000, C702S001000, C702S081000, C702S187000

Reexamination Certificate

active

07855784

ABSTRACT:
A wafer measurement/inspection instrument receives information on at least one of a processing result and an operating state of at least one of a coater/developer that performs film forming/resist processing to a wafer and an exposure apparatus that performs liquid immersion exposure to the wafer, and optimizes inspection conditions of the wafer based on the received information (steps501and517). With this operation, quality inspection of the wafer can be efficiently performed, and as a consequence, it becomes possible to efficiently perform processing to the wafer.

REFERENCES:
patent: 2007/0219736 (2007-09-01), Okita

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