Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-04-07
2010-02-02
Ha, Nathan W (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C257SE23132
Reexamination Certificate
active
07655492
ABSTRACT:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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pa
Chiang Steve S.
Huibers Andrew G.
Patel Satyadev R.
Brady III Wade James
Brill Charles A.
Ha Nathan W
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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