Method of producing an electronic component with flexible...

Details Method of producing an electronic component with flexible... Method of producing an electronic component with flexible...

2005-05-06

2010-10-26

Blum, David S (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C438S612000, C438S761000, C438S778000, C438S787000, C257SE23021, C257SE23069

Reexamination Certificate

active

07820482

ABSTRACT:
A method for producing an electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit.

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