Method for fabricating multilayer circuits

Details Method for fabricating multilayer circuits Method for fabricating multilayer circuits

1987-09-18

1989-01-24

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 29846, 29851, 29852, B32B 3126

Patent

active

047999845

ABSTRACT:
The invention is directed to a method for fabricating multilayer circuits on rigid ceramic substrates using conventional dielectric green tape and thick film conductive pastes in which the number of firing steps is substantially reduced while maintaining excellent X-Y dimensional stability.

REFERENCES:
patent: 3770529 (1973-11-01), Anderson
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4504339 (1985-03-01), Kamahara et al.
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4649125 (1987-03-01), Takeuchi et al.
patent: 4654864 (1987-03-01), Steinberg
patent: 4655864 (1987-04-01), Rellick

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