Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-01-30
2010-02-23
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S691000, C257S532000
Reexamination Certificate
active
07667320
ABSTRACT:
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.
REFERENCES:
patent: 5642262 (1997-06-01), Terrill et al.
patent: 5798567 (1998-08-01), Kelly et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 6400576 (2002-06-01), Davidson
patent: 6535398 (2003-03-01), Moresco
patent: 7183644 (2007-02-01), Wood et al.
patent: 2002/0017700 (2002-02-01), Mori et al.
patent: 2003/0110452 (2003-06-01), Leahy et al.
patent: 2003/0198033 (2003-10-01), Panella et al.
patent: 2003/0218235 (2003-11-01), Searls et al.
patent: 2004/0012085 (2004-01-01), Shioga et al.
“PCT Notification of Transmittal of the International Search Report”, mailed Jul. 27, 2005, for PCT/US2005/012072.
Radhakrishnan Kaladhar
Wood Dustin P.
Buckley Maschoff & Talwalkar LLC
Clark S. V
Intel Corporation
LandOfFree
Integrated circuit package with improved power signal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit package with improved power signal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package with improved power signal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4183127