Component mounting apparatus, vibration controlling...

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S564000, C029S564100, C029S740000, C029S832000

Reexamination Certificate

active

07854061

ABSTRACT:
A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.

REFERENCES:
patent: 5862586 (1999-01-01), Kimura
patent: 7340827 (2008-03-01), Saito et al.
patent: 2006/0206237 (2006-09-01), Morisada
patent: 2001-223498 (2001-08-01), None
patent: 2003-084838 (2003-03-01), None
patent: 2005-150638 (2005-06-01), None
Japanese Office Action issued Sep. 29, 2009 for corresponding Japanese Application No. 2008-049421.

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