Production method of flexible electronic device

Details Production method of flexible electronic device Production method of flexible electronic device

2005-03-11

2010-06-15

Tran, Minh-Loan T (Department: 2826)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S096000, C438S365000, C438S482000, C438S149000, C438S745000, C257SE31041, C257SE27100, C257SE29117, C257SE21411, C257SE33075, C257SE31131, C257SE23080, C257SE23101, C257S675000, C257S706000, C257S712000, C257S059000, C257S072000, C257SE21228

Reexamination Certificate

active

07736997

ABSTRACT:
A flexible electronic device excellent in heat liberation characteristics and toughness and a production method for actualizing thereof in low cost and with satisfactory reproducibility are provided. A protection film is adhered onto the surface of a substrate on which surface a thin film device is formed. Successively, the substrate is soaked in an etching solution to be etched from the back surface thereof so as for the residual thickness of the substrate to fall within the range larger than 0 μm and not larger than 200 μm. Then, a flexible film is adhered onto the etched surface of the substrate, and thereafter the protection film is peeled to produce a flexible electronic device.

REFERENCES:
patent: 5442470 (1995-08-01), Hashimoto
patent: 5798684 (1998-08-01), Endo et al.
patent: 5877034 (1999-03-01), Ramm et al.
patent: 5978061 (1999-11-01), Miyazaki et al.
patent: 6187605 (2001-02-01), Takasu et al.
patent: 6246459 (2001-06-01), Simhambhatla et al.
patent: 6307751 (2001-10-01), Bodony et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6468438 (2002-10-01), Shin et al.
patent: 6476446 (2002-11-01), Ju
patent: 6592969 (2003-07-01), Burroughes et al.
patent: 6878607 (2005-04-01), Inoue et al.
patent: 2002/0030189 (2002-03-01), Ishikawa
patent: 2002/0058577 (2002-05-01), Hayden et al.
patent: 2002/0197771 (2002-12-01), Dotta et al.
patent: 2003/0025118 (2003-02-01), Yamazaki et al.
patent: 2003/0174275 (2003-09-01), Asano et al.
patent: 1199507 (1998-11-01), None
patent: 8-262418 (1996-10-01), None
patent: 2722798 (1997-11-01), None
patent: 9-312349 (1997-12-01), None
patent: 11-212116 (1999-08-01), None
patent: 11-329715 (1999-11-01), None
patent: 2002-111222 (2002-04-01), None
patent: 2002-111226 (2002-04-01), None
patent: 2002-353369 (2002-12-01), None
patent: 2002-0090917 (2002-12-01), None
Asano, Akihiko and Kinoshita, Tomoatsu. “Low-Temperature Polycrystalline-Silicon TFT Color LCD Panel Made of Plastic Substrates.” Society for Information Display 2002 International Symposium Digest of Technical Papers. May 2002: pp. 1196 to 1199.

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