Micro thrust cooling

Details Micro thrust cooling Micro thrust cooling

2008-08-22

2010-11-23

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S689000, C361S694000, C361S709000, C361S710000, C165S104330, C165S104340, C165S109100, C165S124000

Reexamination Certificate

active

07839634

ABSTRACT:
One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.

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