Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-09-18
2010-12-28
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S832000, C029S874000, C257S678000
Reexamination Certificate
active
07856711
ABSTRACT:
A method of forming structure. A substrate and an interposer are provided. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). N interposer channels are coupled to the N substrate channels so as to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.
REFERENCES:
patent: 4921041 (1990-05-01), Akachi
patent: 4931905 (1990-06-01), Cirrito et al.
patent: 5219020 (1993-06-01), Akachi
patent: 5490558 (1996-02-01), Akachi
patent: 5697428 (1997-12-01), Akachi
patent: 5838545 (1998-11-01), Clocher et al.
patent: 5880524 (1999-03-01), Xie
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6490161 (2002-12-01), Johnson
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 7047637 (2006-05-01), deRochemont et al.
Notice of Allowance (Mail Date Jun. 6, 2008) for U.S. Appl. No. 10/933,051, filed Sep. 2, 2004, Confirmation No. 7093.
Office Action (Mail Date Jun. 9, 2010) for U.S. Appl. No. 12/212,925; Filing Date Sep. 18, 2008; Confirmation No. 1210.
U.S. Appl. No. 12/233,061, Filing Date Sep. 18, 2008; Confirmation No. 1432.
U.S. Appl. No. 12/233,104, Filing Date Sep. 18, 2008; Confirmation No. 1508.
Lu Minhua
Mok Lawrence S.
Banks Derris H
International Business Machines - Corporation
Nguyen Tai
Percello Louis J.
Schmeiser Olsen & Watts
LandOfFree
Method of forming a substrate with interposer channels for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a substrate with interposer channels for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a substrate with interposer channels for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4175733