Copper electrodeposition in microelectronics

Details Copper electrodeposition in microelectronics Copper electrodeposition in microelectronics

2007-08-28

2010-10-19

Ghyka, Alexander G (Department: 2812)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S291000, C257SE21175, C257SE21585

Reexamination Certificate

active

07815786

ABSTRACT:
An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.

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