Thermal interface material having carbon nanotubes and...

Details Thermal interface material having carbon nanotubes and... Thermal interface material having carbon nanotubes and...

2008-07-07

2010-12-28

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C257S712000, C257S714000

Reexamination Certificate

active

07859104

ABSTRACT:
A thermal interface material includes a carbon nanotube array, a transition structure, and a matrix. The carbon nanotube array includes a plurality of carbon nanotubes. The transition structure covers at least a part of the surfaces of carbon nanotubes. The matrix encompasses the carbon nanotubes. A component package using the thermal interface material includes a die, a heat spreader, and a thermal interface material. The thermal interface material is disposed between the die and the heater spreader.

REFERENCES:
patent: 2006/0131679 (2006-06-01), Hantschel et al.
patent: 2006/0231946 (2006-10-01), Pan et al.
patent: 2009/0218681 (2009-09-01), Chrysler et al.

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