Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2005-06-23
2010-12-21
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S098000, C257S100000, C257S675000, C257S676000, C257S712000, C257SE33058, C257SE33059
Reexamination Certificate
active
07855395
ABSTRACT:
Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
REFERENCES:
patent: 5177669 (1993-01-01), Juskey
patent: 5958100 (1999-09-01), Farnworth
patent: 6274924 (2001-08-01), Carey et al.
patent: 6517218 (2003-02-01), Hochstein
patent: 6747293 (2004-06-01), Nitta et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 7321161 (2008-01-01), Teixeira et al.
patent: 2001/0030866 (2001-10-01), Hochstein
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0227145 (2004-11-01), Abe et al.
patent: 2004/0227149 (2004-11-01), Ibbetson et al.
patent: 2005/0045901 (2005-03-01), Wall, Jr.
patent: 2005/0269587 (2005-12-01), Loh et al.
patent: 2006/0012299 (2006-01-01), Suehiro
patent: 2006/0103012 (2006-05-01), Chin
patent: 1380704 (2002-11-01), None
patent: 10214119 (2003-10-01), None
patent: 1246266 (2002-10-01), None
patent: 1249874 (2002-10-01), None
patent: 1439584 (2004-07-01), None
patent: 1484802 (2004-12-01), None
patent: 7111343 (1995-04-01), None
patent: 8-335720 (1996-12-01), None
patent: 11-121809 (1999-04-01), None
patent: 11112036 (1999-04-01), None
patent: 2000-150967 (2000-05-01), None
patent: 2001-185763 (2001-07-01), None
patent: 2001223305 (2001-08-01), None
patent: 2002-252373 (2002-09-01), None
patent: 2002314139 (2002-10-01), None
patent: 2002359403 (2002-12-01), None
patent: 2004-221598 (2004-08-01), None
patent: 2004235261 (2004-08-01), None
patent: 2134000 (1999-07-01), None
patent: WO 00/55914 (2000-09-01), None
patent: WO 2004102685 (2004-11-01), None
patent: 2006006544 (2006-01-01), None
Office Action dated Jun. 2, 2009 (for co-pending U.S. Appl. No. 12/196,028).
European Search Report dated Aug. 24, 2009.
Kim Do-Hyung
Lee Chung-Hoon
Lee Keon-Young
Cao Phat X
Garrity Diana C
H.C. Park & Associates PLC
Seoul Semiconductor Co. Ltd.
LandOfFree
Light emitting diode package having multiple molding resins... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light emitting diode package having multiple molding resins..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package having multiple molding resins... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4174031