Semiconductor device, method of manufacturing thereof,...

Details Semiconductor device, method of manufacturing thereof,... Semiconductor device, method of manufacturing thereof,...

2007-07-30

2010-12-14

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S465000, C438S613000, C438S623000, C257SE21508

Reexamination Certificate

active

07851265

ABSTRACT:
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.

REFERENCES:
patent: 6333565 (2001-12-01), Hashimoto
patent: 6441493 (2002-08-01), Kim
patent: 6515372 (2003-02-01), Narizuka
patent: 6608389 (2003-08-01), Hashimoto
patent: 6707153 (2004-03-01), Kuwabara et al.
patent: 6781224 (2004-08-01), Yoneda et al.
patent: 7129581 (2006-10-01), Ito
patent: 7183189 (2007-02-01), Hashimoto
patent: 2001/0015496 (2001-08-01), Watase
patent: 2001/0026021 (2001-10-01), Honda
patent: 2003/0148558 (2003-08-01), Kubo
patent: 2003/0155652 (2003-08-01), Murata
patent: 2003/0162386 (2003-08-01), Ogawa et al.
patent: 0 917 195 (1998-05-01), None
patent: 1 198 003 (2002-04-01), None
patent: 2000-323604 (2000-11-01), None
patent: 2002-118205 (2002-04-01), None
patent: WO 9825298 (1998-05-01), None
patent: WO 9825297 (1998-06-01), None
patent: WO 0055898 (2000-09-01), None

Affiliated with

Also associated with

Rating

Semiconductor device, method of manufacturing thereof,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, method of manufacturing thereof,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, method of manufacturing thereof,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4173771