Board having electronic parts mounted by using under-fill...

Details Board having electronic parts mounted by using under-fill... Board having electronic parts mounted by using under-fill...

2006-08-08

2010-02-16

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S789000, C257S795000, C438S124000

Reexamination Certificate

active

07663253

ABSTRACT:
A board1according to the present invention includes a board main body3; electronic parts5electrically connected to and mounted on the board main body3; and an under-fill material19with which a part between the board main body3and a surface of the electronic parts5electrically connected to the board main body is filled. A hole21passing through a layer19aof the under-fill material that flows outside from a connecting area of the electronic parts5and the board main body3is provided for electrically connecting other parts to the board main body.

REFERENCES:
patent: 5536765 (1996-07-01), Papathomas
patent: 6977338 (2005-12-01), Muro et al.
patent: 2001/0004130 (2001-06-01), Higashi et al.
patent: 2003/0113952 (2003-06-01), Sambasivam et al.
patent: 2004/0178510 (2004-09-01), Sunohara et al.
patent: 1 447 850 (2004-08-01), None
patent: 2000-164610 (2000-06-01), None

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