Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-10-01
2010-02-23
Levi, Dameon E (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S737000, C361S764000, C174S260000, C029S841000, C257S678000, C257S787000
Reexamination Certificate
active
07667976
ABSTRACT:
A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.
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Nakagawa Mitsuru
Sugimoto Keiichi
Denso Corporation
Levi Dameon E
Nixon & Vanderhye P.C.
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