Semiconductor device having solder-free gold bump contacts...

Details Semiconductor device having solder-free gold bump contacts... Semiconductor device having solder-free gold bump contacts...

2007-12-07

2010-12-07

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S772000, C257SE23021

Reexamination Certificate

active

07847399

ABSTRACT:
A semiconductor device has a chip (101) with gold studs (212) assembled on a tape substrate (102), which has solder balls (103) for attachment to external parts. The tape substrate (about 30 to 70 μm thick) has on its first surface first copper contact pads (221) covered with a continuous thin nickel layer (222) of about 0.04 to 0.12 μm thickness. Gold including stud (212) is contacting the nickel. On the second substrate surface are second copper contact pads (231) covered with an alloy layer (about 2 to 3 μm thick) including gold, copper/tin alloys, and copper
ickel/tin alloys; the alloys are metallurgically attached to the second copper pad and substantially free of unalloyed nickel. A reflow body (103) comprising tin is metallurgically attached to the alloy layer of each second pad.

REFERENCES:
patent: 5616958 (1997-04-01), Laine et al.
patent: 5892271 (1999-04-01), Takeda et al.
patent: 6130479 (2000-10-01), Chalco et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6441488 (2002-08-01), Smith
patent: 6669077 (2003-12-01), Kawashima et al.
patent: 7233074 (2007-06-01), Ano
patent: 2003/0234453 (2003-12-01), Liu et al.
patent: 2004/0262778 (2004-12-01), Hua
patent: 2006/0113683 (2006-06-01), Dean et al.
patent: 2008/0292492 (2008-11-01), Ingham et al.

Affiliated with

Also associated with

Rating

Semiconductor device having solder-free gold bump contacts... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having solder-free gold bump contacts..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having solder-free gold bump contacts... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4173068