Method and apparatus for severing disks of brittle material,...

Electric heating – Metal heating – By arc

Reexamination Certificate

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Details

C219S121600, C219S121670, C219S121680, C219S121690, C219S121840

Reexamination Certificate

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07816626

ABSTRACT:
The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.

REFERENCES:
patent: 5254833 (1993-10-01), Okiyama
patent: 5968382 (1999-10-01), Matsumoto et al.
patent: 6676878 (2004-01-01), O'Brien et al.
patent: 6756562 (2004-06-01), Kurosawa et al.
patent: 2004/0188400 (2004-09-01), Peng et al.
patent: 2005/0023260 (2005-02-01), Takyu et al.
patent: 2005/0029239 (2005-02-01), Matsumoto et al.
patent: 693 04 194 (1997-01-01), None
patent: 198 56 346 (2000-06-01), None
patent: 100 16 628 (2001-10-01), None
patent: 102 35 234 (2002-08-01), None
patent: 696 29 704 (2003-07-01), None
patent: 103 17 115 (2004-07-01), None
patent: 10 2004 014 276 (2005-10-01), None
patent: 1 570 941 (2005-02-01), None
patent: 2001144037 (2001-05-01), None
patent: 2004025187 (2004-01-01), None
patent: 2004066341 (2004-03-01), None
patent: 03/018276 (2003-06-01), None
Machine Translation of JP-2004-025187.
Machine Translation of DE 102 35 234.
Patent Abstracts of Japan, Publication No. 08025064 published Jan. 30, 1996 Method and Device for Laser Working, Sony Corp.
Patent Abstracts of Japan, Publication No. 20000154467 published Jan. 18, 2000 Working Method of Workpiece by Beam and Its Working Device, Shin Meiwa Ind Co Ltd.
Patent Abstracts of Japan, Publication No. 2003088980 published Mar. 25, 2003 Laser Beam Machining Method, Hamamatsu Photonics KK.

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