Composition of polycyanate ester and biphenyl epoxy resin

Details Composition of polycyanate ester and biphenyl epoxy resin Composition of polycyanate ester and biphenyl epoxy resin

2003-09-29

2010-10-19

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S400000, C523S453000, C523S454000, C523S455000, C523S462000, C525S396000

Reexamination Certificate

active

07816430

ABSTRACT:
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

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