Multilayer inductor

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

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Details

C336S107000, C336S192000, C336S223000, C336S232000, C029S602100

Reexamination Certificate

active

07843303

ABSTRACT:
A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power routing between the top magnetic layer signal/power contacts and the bottom magnetic layer signal/power contacts. The top external conductive pattern accommodates a semiconductor chip in a flip chip configuration.

REFERENCES:
patent: 3185947 (1965-05-01), Freymodsson
patent: 3964087 (1976-06-01), Mallon
patent: 5184103 (1993-02-01), Gadreau et al.
patent: 5602517 (1997-02-01), Kaneko et al.
patent: 6073339 (2000-06-01), Levin
patent: 6930584 (2005-08-01), Edo et al.

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