Stacked semiconductor package and method for manufacturing...

Details Stacked semiconductor package and method for manufacturing... Stacked semiconductor package and method for manufacturing...

2007-09-07

2010-12-28

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S666000, C438S667000, C257SE23011, C257SE21001

Reexamination Certificate

active

07858439

ABSTRACT:
Disclosed are a stacked semiconductor package and a method for manufacturing the same. The method for manufacturing a stacked semiconductor package includes preparing a substrate formed with a seed metal layer; laminating semiconductor chips having via holes aligned with one another on the seed metal layer to form a semiconductor chip module; and growing a conductive layer inside of the via holes using the seed metal layer to form a conductive growth layer inside of the via holes.

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Machine translation for Jae Bong Ryu, The stacked chip package and manufacturing method thereof,Jun. 25, 2003, pp. 1-16.

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