Laser processing method and laser processing apparatus

Details Laser processing method and laser processing apparatus Laser processing method and laser processing apparatus

2005-10-28

2010-10-05

Heinrich, Samuel M (Department: 3742)

Electric heating

Metal heating

By arc

C219S121690, C219S121700, C219S121710

Reexamination Certificate

active

07807942

ABSTRACT:
Ultrashort pulse laser processing bores, welds or cuts objects (work pieces) by converging ultrashort laser pulses by a lens on the objects (work pieces) positioned at the focus and heating small spots or narrow lines on the objects (work pieces). Shortage of a focal depth of the lens prevents the ultrashort pulse laser processing from positioning the object (a work piece) and forming a deep, constant-diameter cylindrical hole. Z-parameter is defined to be Z=2fcΔt/Δi2, where Δt is a FWHM pulse width of the ultrashort pulse laser, Δi is a FWHM beam diameter of the ultrashort pulse, f is a focal length of the lens and c is the light velocity in vacuum. Selection of an optical system including a diffraction-type lens which gives the Z-parameter less than 1 (Z<1) prolongs the focal depth. Expansion of the focal depth facilitates the positioning of objects (work pieces) and enables the ultrashort pulse laser apparatus to bore a deep, constant-diameter cylindrical hole.

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