Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2008-06-30
2010-12-07
Tran, Long K (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S138000, C438S152000, C438S458000, C438S488000, C257SE21088, C257SE21122, C257SE21123, C257SE21214, C257SE21388
Reexamination Certificate
active
07846814
ABSTRACT:
A method of forming a semiconductor structure includes providing a substrate and providing a detach region which is carried by the substrate. A device structure which includes a stack of crystalline semiconductor layers is provided, wherein the detach region is positioned between the device structure and substrate. The stack is processed to form a vertically oriented semiconductor device.
REFERENCES:
patent: 6222251 (2001-04-01), Holloway
patent: 7217636 (2007-05-01), Atanackovic
patent: 2003/0113963 (2003-06-01), Wurzer
patent: 2004/0080002 (2004-04-01), Agarwal et al.
Schmeiser Olsen & Watts LLP
Tran Long K
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