Heating apparatus, heating method, coating apparatus, and...

Details Heating apparatus, heating method, coating apparatus, and... Heating apparatus, heating method, coating apparatus, and...

2007-02-16

2010-11-23

Pelham, Joseph M (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S390000, C219S388000, C118S728000, C198S817000, C198S952000, C414S157000

Reexamination Certificate

active

07838801

ABSTRACT:
A heating apparatus cooling a substrate heated by a hot plate at a cooling position adjacent to the hot plate, capable of achieving a smaller height and reducing an operation time in the apparatus, in which contamination of the substrate by particles or the like is less likely, and the like, are provided. The heating apparatus includes a hot plate for heating a wafer representing a substrate from below, in a heating chamber having a wafer load/unload port. In addition, a wire for transferring the wafer between a cooling position of the substrate adjacent to the load/unload port of the heating chamber (position above a cooling plate) and a position above the hot plate is provided and extends. The wafer is mounted on a gap forming member provided on the wire, and thereafter loaded into the heating chamber.

REFERENCES:
patent: 4457419 (1984-07-01), Ogami et al.
patent: 7628612 (2009-12-01), Otsuka et al.
patent: 59228731 (1984-12-01), None
patent: 62-017133 (1987-02-01), None
patent: 2004-235469 (2004-08-01), None
patent: 2004-319626 (2004-11-01), None
Japanese Office Action mailed on Jun. 8, 2010 for Application No. 2006-041208 with English translation.

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