Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-03
2010-06-22
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S767000, C361S773000, C361S774000, C361S776000, C361S790000
Reexamination Certificate
active
07742313
ABSTRACT:
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
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Search Report and Written Opinion for Singapore Application No. 200305589-4, Australian Patent Office, Apr. 8, 2005.
Heng Mung Suan
Johnson Mark S.
Leong Vince Chan Seng
Tan Kok Chua
Dinh Tuan T
Micro)n Technology, Inc.
Perkins Coie LLP
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