Semiconductor device and method for producing the same

Details Semiconductor device and method for producing the same Semiconductor device and method for producing the same

2006-11-30

2010-06-29

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23034, C257SE23044

Reexamination Certificate

active

07745929

ABSTRACT:
A semiconductor device (1) has a semiconductor component (2), a first electrode (6) and a control electrode (7) being arranged on the top side (4). The semiconductor device (1) furthermore has a circuit carrier (3) having a chip island (9) and a plurality of flat conductors (10). The rear side (5) of the semiconductor component (2) is mounted on the chip island (9). The first electrode (6) is electrically connected to a first flat conductor (13) via a first contact clip (16) and the control electrode (7) is electrically connected to a control flat conductor (14) via the second contact clip (19). The upper surface (33) of the first contact clip (16) is at least partly arranged in a plane which is further away from the top side (4) of the semiconductor component (2) than the entire upper surface (34) of the second contact clip (19).

REFERENCES:
patent: 6465276 (2002-10-01), Kuo
patent: 6630726 (2003-10-01), Crowley et al.
patent: 2004/0080028 (2004-04-01), Yanagisawa
patent: 2007/0278664 (2007-12-01), Carney et al.
patent: 102004021838 (2005-09-01), None
Sawle et al. “DirectFET™-A Proprietary New Source Mounted Power Package for Board Mounted Power” (1 page).
“HPA TrenchMOS™ in LFPAK” Phillips (1 page).
Sawle et al. “Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors” IEEE (1 page), 2002.
German Office Action for German Patent Application No. 10 2005 057 401.7 (4 pages), Sep. 5, 2006.

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