Coating processes – Direct application of electrical – magnetic – wave – or... – Ion plating or implantation
Reexamination Certificate
2007-01-30
2010-02-02
Tran, Binh X (Department: 1792)
Coating processes
Direct application of electrical, magnetic, wave, or...
Ion plating or implantation
C427S531000, C427S097900, C427S099500, C427S102000
Reexamination Certificate
active
07655282
ABSTRACT:
A method of forming a patterned thin film comprises the step of forming a frame having an undercut near the bottom thereof on an electrode film, and the plating step of forming the patterned thin film by plating through the use of the frame. The patterned thin film includes a plurality of linear portions disposed side by side. Each of the linear portions has a portion close to the electrode film. This portion has a width greater than the width of the remaining portion of each of the linear portions.
REFERENCES:
patent: 3093502 (1963-06-01), Drelich
patent: 3853715 (1974-12-01), Romankiw
patent: 5043043 (1991-08-01), Howe et al.
patent: 5622761 (1997-04-01), Cole
patent: 5721078 (1998-02-01), Kamijima
patent: 5725997 (1998-03-01), Kamijima
patent: 5747198 (1998-05-01), Kamijima
patent: 5773200 (1998-06-01), Okazaki et al.
patent: 5989667 (1999-11-01), Tayebi
patent: 6165587 (2000-12-01), Nonaka
patent: 6201243 (2001-03-01), Jerominek
patent: 6289578 (2001-09-01), Kamijima
patent: 6452743 (2002-09-01), Sasaki
patent: 6459542 (2002-10-01), Sato
patent: 6655207 (2003-12-01), Speldrich et al.
patent: 6683387 (2004-01-01), Brownfield
patent: 6764936 (2004-07-01), Daneman et al.
patent: 2001/0055831 (2001-12-01), Daneman et al.
patent: B2-56-36706 (1981-08-01), None
patent: A-02-064909 (1990-03-01), None
patent: 02-281623 (1990-11-01), None
patent: A-08-069111 (1996-03-01), None
patent: A-09-096909 (1997-04-01), None
patent: A-09-252087 (1997-09-01), None
patent: A-10-116402 (1998-05-01), None
Oliff & Berridg,e PLC
TDK Corporation
Tran Binh X
LandOfFree
Method of forming patterned film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming patterned film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming patterned film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4159384