Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-10-23
1992-05-26
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
228 31, 2281802, 29840, 174261, H01R 900, B23K 2000
Patent
active
051162288
ABSTRACT:
A method and apparatus is provided for forming bumps on a plurality of IC chips arranged in a checkered pattern on a wafer. The bumps are formed from bump bases fixed to each IC chip. A forming tool having a recessed part of a height that is greater than the height of the bump bases is used to deform the bump bases into bumps. The forming tool is pressed by an elevating driving device against the bump bases under pressure sufficient to deform a respective part of each of the bump bases secured to each IC chip into a shape corresponding to that of the recess defined by the forming tool.
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patent: 3918144 (1975-11-01), Mimata et al.
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IBM Tech Disclosure Bull vol. 23 No. 5 Oct. 1980 pp. 1877-1878 by B. D. Martin et al.
Kabeshita Akira
Kitayama Yoshifumi
Arbes Carl J.
Matsushita Electric - Industrial Co., Ltd.
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