Polishing device and substrate processing device

Details Polishing device and substrate processing device Polishing device and substrate processing device

2003-04-09

2010-12-14

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345220

Reexamination Certificate

active

07850817

ABSTRACT:
A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

REFERENCES:
patent: 5248024 (1993-09-01), Yokosuka
patent: 5830045 (1998-11-01), Togawa et al.
patent: 6036582 (2000-03-01), Aizawa et al.
patent: 6354922 (2002-03-01), Sakurai et al.
patent: 6358126 (2002-03-01), Jackson et al.
patent: 6607427 (2003-08-01), Togawa et al.
patent: 6625556 (2003-09-01), Conboy et al.
patent: 6942541 (2005-09-01), Togawa et al.
patent: 6997782 (2006-02-01), Nishi et al.
patent: 7063600 (2006-06-01), Yoshida et al.
patent: 7101259 (2006-09-01), Kimura et al.
patent: 7108589 (2006-09-01), Kimura et al.
patent: 2001/0009157 (2001-07-01), Maekawa et al.
patent: 2001/0024937 (2001-09-01), Inaba
patent: 1342998 (2002-04-01), None
patent: 0 761 387 (1997-03-01), None
patent: 1 072 359 (2001-01-01), None
patent: 6-232016 (1994-08-01), None
patent: 10-92781 (1998-04-01), None
patent: 10-172939 (1998-06-01), None
patent: 11-238707 (1999-08-01), None
patent: 2000-91292 (2000-03-01), None
patent: 2000-117627 (2000-04-01), None
patent: 2001-38614 (2001-02-01), None
patent: 2001-274121 (2001-10-01), None
patent: 95/31309 (1995-11-01), None
Korean Office Action issued Apr. 30, 2009 in corresponding Korean Application No. Oct. 2003-7016610 with English translation.
Chinese Office Action issued Sep. 8, 2006 in corresponding Chinese Application No. 03801220 with English translation.
Chinese Office Action issued Jul. 20, 2007 in corresponding Chinese Application No. 03801220 with English translation.
Written Opinion issued Aug. 26, 2004 and Response to the Written Opinion dated Feb. 28, 2005 in corresponding Singapore Patent Application No. 200307630-4.
Supplementary European Search Report issued Dec. 14, 2009 in EP 03 74 6438.

Affiliated with

Also associated with

Rating

Polishing device and substrate processing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing device and substrate processing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing device and substrate processing device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4157893