Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2004-01-15
2010-02-09
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S666000, C257S690000, C257SE23043
Reexamination Certificate
active
07659634
ABSTRACT:
There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
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Japanese Office Action with English translation, issued in Japanese Patent Application No. 2005-071274 dated Jul. 2, 2008.
Kobayashi Takeshi
Sugoh Hisao
McDermott Will & Emery LLP
Monbleau Davienne
Nguyen Dilinh P
Panasonic Corporation
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