Semiconductor package and method of manufacturing the same

Details Semiconductor package and method of manufacturing the same Semiconductor package and method of manufacturing the same

2007-09-14

2010-11-09

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S720000, C257S741000, C257S772000, C257S778000

Reexamination Certificate

active

07830009

ABSTRACT:
A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

REFERENCES:
patent: 6297063 (2001-10-01), Brown et al.
patent: 2001-177052 (2001-06-01), None
patent: 2002-141633 (2002-05-01), None
patent: 2002-329723 (2002-11-01), None
patent: 2003-109689 (2003-04-01), None
patent: 2004-75422 (2004-03-01), None
M. Nihei, et al.; “Simultaneous formation of multi-wall carbon nanotubes and their low-resistance ohmic contacts for future ULSI via internconnects;”Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials; 2003; pp. 798-799.

Affiliated with

Also associated with

Rating

Semiconductor package and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4154808