Method of manufacturing printed wiring board

Details Method of manufacturing printed wiring board Method of manufacturing printed wiring board

2007-12-26

2010-06-08

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025420, C029S825000, C029S829000, C029S831000, C029S842000, C029S846000, C174S250000, C174S260000, C174S262000, C257S531000, C257S664000, C257S678000, C257S698000

Reexamination Certificate

active

07730614

ABSTRACT:
A method of manufacturing a printed wiring board including preparing a high-dielectric capacitor sheet including a ceramic high-dielectric layer sandwiched by upper and lower electrode sheets, attaching the high-dielectric capacitor sheet to a first insulating layer, forming through holes for the upper and lower electrode sheets such that the through holes penetrate through the ceramic high-dielectric layer and upper and lower electrode sheets, forming a second insulating layer which fills the through holes and covers an upper surface of the high-dielectric capacitor sheet, forming an upper electrode connecting first hole, an upper electrode connecting second hole and a lower electrode connecting hole, filling the upper holes with conductive material such that the upper electrode connecting first hole and the upper electrode connecting second hole are connected to form an upper electrode connection portion, and filling the lower electrode connecting hole with conductive material to form a lower electrode connecting portion.

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