Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2007-03-02
2010-11-16
Pham, Thanh V (Department: 2894)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S114000, C257S734000, C257S780000
Reexamination Certificate
active
07833881
ABSTRACT:
Packaged semiconductor components and methods for manufacturing packaged semiconductor components. In one embodiment a semiconductor component comprises a die having a semiconductor substrate and an integrated circuit. The substrate has a first side, a second side, a sidewall between the first and second sides, a first indentation at the sidewall around a periphery of the first side, and a second indentation at the sidewall around a periphery of the second side. The component can further include a first exterior cover at the first side and a second exterior cover at the second side. The first exterior cover has a first extension in the first indentation, and the second exterior cover has a second extension in the second indentation. The first and second extensions are spaced apart from each other by an exposed portion of the sidewall.
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International Search Report and Written Opinion for PCT/US2008/055528, Aug. 1, 2008.
Laurenzi, III Mark A
Micro)n Technology, Inc.
Perkins Coie LLP
Pham Thanh V
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