Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-02-01
2010-10-26
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S766000, C361S523000
Reexamination Certificate
active
07821795
ABSTRACT:
A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
REFERENCES:
patent: 6370013 (2002-04-01), Iino et al.
patent: 6577490 (2003-06-01), Ogawa et al.
patent: 7126811 (2006-10-01), Hirano et al.
patent: 7319599 (2008-01-01), Hirano et al.
patent: 2002/0086561 (2002-07-01), Ogawa et al.
patent: 2004/0125543 (2004-07-01), Hirano et al.
patent: 4-283987 (1992-10-01), None
patent: 2738950 (1998-01-01), None
patent: 10-097952 (1998-04-01), None
patent: 11-220262 (1999-08-01), None
patent: 2001-156211 (2001-06-01), None
patent: 2001-185460 (2001-07-01), None
patent: 2002-246759 (2002-08-01), None
patent: 2002-359160 (2002-12-01), None
patent: 2004-221534 (2004-08-01), None
Asahi Toshiyuki
Katsumata Masaaki
Miki Katsumasa
Nakayama Takeshi
Saitou Yoshiyuki
Dinh Tuan T
Panasonic Corporation
Wenderoth Lind & Ponack, LLP.
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