Plasma processing apparatus, method for producing reaction...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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Reexamination Certificate

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07543546

ABSTRACT:
A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.

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PCT International Search Report for PCT/JP2004/007598 mailed on Jan. 25, 2005.
Notification of Reasons for Refusal for the Application No. 2004-155209 from Japan Patent Office, mailed May 27, 2008.

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