Method of producing wiring board

Details Method of producing wiring board Method of producing wiring board

2006-01-25

2009-06-23

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S848000

Reexamination Certificate

active

07549222

ABSTRACT:
A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as differential transmission at via parts. For this wiring base board, an insulating substrate is used. The wiring base board has a first via hole part which is formed in the insulating substrate and provides a plurality of circumferential face parts, and a plurality of second via hole parts, forming concentric circles with the circumferential face parts, which are formed in the first via hole part through an insulator. By this, a differential wiring structure and coaxial structure parts are constituted.

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CN 200410085189.5 Office Action dated Aug. 11, 2006.
Japanese Notification of Reason for Refusal dated Mar. 24, 2009, issued in corresponding patent application No. 2004-140253.

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