Memory module assembly including heat sink attached to...

Details Memory module assembly including heat sink attached to... Memory module assembly including heat sink attached to...

2007-03-26

2009-10-27

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S710000, C361S709000, C361S711000, C257S707000

Reexamination Certificate

active

07609523

ABSTRACT:
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.

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