Layer acoustic wave device and method of making the same

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S31300R, C310S340000

Reexamination Certificate

active

07619347

ABSTRACT:
The present invention provides a layer acoustic wave device that is formed without requiring a bonding process to attach a secondary substrate. In particular, the layer acoustic wave device is formed from a substrate, an interdigital transducer created on the substrate, a dielectric layer formed over the interdigital transducer and substrate, and at least one isolation layer formed over the dielectric layer. The at least one isolation layer has sufficient properties to minimize particle displacement on a top surface of the at least one isolation layer. The at least one isolation layer has a greater acoustic impedance than that of the dielectric layer.

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C.C.W. Ruppel et al., “Surface Acoustic Wave Devices for Wireless Local Area Networks,” International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems, Mar. 2001, Chiba University.
Masatsune Yamaguchi et al., “Highly Piezoelectric Boundary Waves in Si/Si02/LiNbO3 Structure,” 1998 IEEE International Frequency Control Symposium, 1998, pp. 484-488, IEEE.

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