Electroplating method for a semiconductor device

Details Electroplating method for a semiconductor device Electroplating method for a semiconductor device

2008-01-17

2009-10-20

Wong, Edna (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

Reexamination Certificate

active

07604727

ABSTRACT:
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.

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