Method of growing semiconductor crystal

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

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C117S084000, C117S088000, C117S089000, C117S090000, C117S092000, C117S097000, C117S100000, C117S101000, C117S103000, C117S105000, C117S106000, C117S108000, C117S109000, C117S951000, C117S952000

Reexamination Certificate

active

07625447

ABSTRACT:
SiC is a very stable substance, and it is difficult to control the condition of a SiC surface to be suitable for crystal growth in conventional Group III nitride crystal growing apparatuses. This problem is solved as follows. The surface of a SiC substrate1is rendered into a step-terrace structure by performing a heating process in an atmosphere of HCl gas. The surface of the SiC substrate1is then treated sequentially with aqua regia, hydrochloric acid, and hydrofluoric acid. A small amount of silicon oxide film formed on the surface of the SiC substrate1is etched so as to form a clean SiC surface3on the substrate surface. The SiC substrate1is then installed in a high-vacuum apparatus and the pressure inside is maintained at ultrahigh vacuum (such as 10−6to 10−8Pa). In the ultrahigh vacuum state, a process of irradiating the surface with a Ga atomic beam5at time t1at temperature of 800° C. or lower and performing a heating treatment at 800° C. or higher is repeated at least once. The temperature is then set to the growth temperature of an AlN film, and the SiC substrate surface3is initially irradiated with Al atoms8ain ultrahigh vacuum state, followed by the feeding of N atoms8b.

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