Optically interactive device package array

Details Optically interactive device package array Optically interactive device package array

2005-04-11

2009-06-02

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000

Reexamination Certificate

active

07541658

ABSTRACT:
An image sensor package and methods for simultaneously fabricating a plurality of such packages. A layer of barrier material comprising a matrix of raised walls is formed around chip attachment areas located in an array on a carrier substrate to create chip cavities. Image sensor chips are wire bonded within the chip cavities, and a unitary transparent cover is sealed in place over the entire assembly. The resultant image sensor package array is then singulated along lines running between the chip attachment areas and in parallel to the raised walls to provide individual image sensor packages. The layer of barrier material may be formed directly on the carrier substrate by molding methods or by depositing a series of curable layers of liquid or flowable material in a stacked fashion. Alternatively, the layer of barrier material may be preformed as a unitary frame and then secured to the carrier substrate.

REFERENCES:
patent: 4601526 (1986-07-01), White et al.
patent: 4878043 (1989-10-01), Heusquin et al.
patent: 5270491 (1993-12-01), Carnall et al.
patent: 5458716 (1995-10-01), Alfaro et al.
patent: 5709960 (1998-01-01), Mays et al.
patent: 5811799 (1998-09-01), Wu
patent: 5923958 (1999-07-01), Chou
patent: 6143588 (2000-11-01), Glenn
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giboney et al.
patent: 6545332 (2003-04-01), Huang
patent: 6809412 (2004-10-01), Tourino et al.
patent: 2002/0037423 (2002-03-01), Yamamoto et al.
patent: 2003/0186047 (2003-10-01), Trouilhet
patent: 2003/0222333 (2003-12-01), Bolken et al.
patent: 2005/0029549 (2005-02-01), Cobbley et al.
patent: 2006/0051892 (2006-03-01), Bolken et al.
Data Sheet, Amkor Technology, Inc., “VisionPak LLC,” 2 pages.

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