Programmable capacitor associated with an input/output pad

Details Programmable capacitor associated with an input/output pad Programmable capacitor associated with an input/output pad

2002-08-29

2009-10-13

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S532000, C257S724000, C257S786000, C257SE23144

Reexamination Certificate

active

07602039

ABSTRACT:
The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

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Anderson, Gonzales, Knecht and Fowler: “ESD Protection under Wire Bonding Pads,”ESO/Symposium99-88thru99-94, (1999).
Great Britain Search Report, Application No. GB 0220219.0 dated Apr. 3, 2003.

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