Dynamic magnetic information storage or retrieval – Head – Coil
Reexamination Certificate
2004-11-09
2009-06-30
Heinz, A. J. (Department: 2627)
Dynamic magnetic information storage or retrieval
Head
Coil
C360S123290, C360S123500
Reexamination Certificate
active
07554763
ABSTRACT:
A magnetic head includes a plurality of coil elements disposed in a space defined by a lower core layer, a pole layer, and a back gap layer. A coil insulator fills the space so as to cover the coil elements. The top face of the pole layer, the top face of the coil insulator, the top faces of the coil elements, and the top face of the back gap layer form a planarized plane. The coil elements are disposed on a recess formed on the lower core layer. The bottom faces of the coil elements are disposed at substantially the same height as the top face of the lower core layer. The top faces of the coil elements lie in the planarized plane.
REFERENCES:
patent: 5969911 (1999-10-01), Hikami et al.
patent: 6353511 (2002-03-01), Shi et al.
patent: 6490127 (2002-12-01), Sasaki
patent: 7047625 (2006-05-01), Han et al.
patent: 7130153 (2006-10-01), Shen et al.
patent: 05-242429 (1993-09-01), None
patent: 2000-357307 (2000-12-01), None
patent: 2001-76320 (2001-03-01), None
patent: 2001-195707 (2001-07-01), None
patent: 2002-25009 (2002-01-01), None
Office Action issued in corresponding Japanese Patent Application No. 2003-384427; issued Nov. 13, 2007.
Office Action issued in corresponding Japanese Patent Application No. 2003-384427; issued Aug. 19, 2008.
Brinks Hofer Gilson & Lione
Heinz A. J.
TDK Corporation
LandOfFree
Magnetic head having an insulating layer comprised of an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Magnetic head having an insulating layer comprised of an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetic head having an insulating layer comprised of an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4136055